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Job Description The NM DMO Yield Department is looking for process integration and defect reduction engineers to support interconnect and advanced packaging semiconductor chip fabrication. Engineers in the NM DMO Yield Department will support Fab 11X and...
Job Description The New Mexico Disaggregation Manufacturing Organization (NM DMO) Yield Department is looking for process integration and defect reduction engineers to support interconnect and advanced packaging semiconductor chip fabrication. Engineers...
Job Description Intel's Advanced Packaging (AP) technologies extend and drive Moore's Law as the company aspires to a trillion transistors in a package by 2030. Intel has led the industry in disaggregated advanced packaging for a couple of decades. Its...
Job Description Experienced Development Engineer capable of developing Plating processes to meet the needs of next generation semiconductor devices. Defines and implements processes related to e-test, film thickness and layer performance criteria for...
Job Description As a Photolithography Scanner Engineer, you'll be part of Intel's High-Volume Manufacturing (HVM) fabrication process development team that is driving innovation for the next generation of silicon products. You will play a critical role...
Job Description Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. As part of Intel's new IDM2.0...